INTERNATIONAL PATENT: YANG, JI WOO, 양지우 FILES APPLICATION FOR "SPACE FORMING MEMBER AND SEMICONDUCTOR PACKAGE ASSEMBLY"

GENEVA, Feb. 4 -- YANG, Ji Woo (27 Gaebong-ro 18-gil,Guro-gu,Seoul 08332), 양지우 (서울특별시구로구개봉로18길 27) filed a patent application (PCT/KR2024/009778) for "SPACE FORMING MEMBER AND SEMICONDUCTOR PACKAGE ASSEMBLY" on Jul 09, 2024. With publication no. WO/2025/023567, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YANG, Soon Ock (104-602, 6 Gaebong-ro 20-gil,Guro-gu,Seoul 08329), 양순옥 (서울...