INTERNATIONAL PATENT: YAMAHA HATSUDOKI KABUSHIKI KAISHA, ヤマハ発動機株式会社 FILES APPLICATION FOR "WAFER PROCESSING METHOD AND WAFER PROCESSING SYSTEM"

GENEVA, June 10 -- YAMAHA HATSUDOKI KABUSHIKI KAISHA (2500 Shingai, Iwata-shi, Shizuoka4388501), ヤマハ発動機株式会社 (静岡県磐田市新貝２５００番地) filed a patent application (PCT/JP2023/042819) for "WAFER PROCESSING METHOD AND WAFER PROCESSING SYSTEM" on Nov 29, 2023. With publication no. WO/2025/115147, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SUZUKI, Yoshikuni (c/o YAMA...