INTERNATIONAL PATENT: XILINX, INC. FILES APPLICATION FOR "TAMPER SENSOR FOR 3-DIMENSIONAL DIE STACK"

GENEVA, April 8 -- XILINX, INC. (Attn: Legal Department2100 Logic DriveSan Jose, California 95124) filed a patent application (PCT/US2024/044804) for "TAMPER SENSOR FOR 3-DIMENSIONAL DIE STACK" on Aug 30, 2024. With publication no. WO/2025/071865, the details related to the patent application was published on Apr 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEBOEUF, Thomas Paul (5051 Journal Center Blvd., NE, Suite 310Albuquerque, New Mexico 87019), ANDERSON, James (5051 Journal Center Blvd., NE, Suite 310Orlando, Florida 32817), WESSELKAMPER, James D. (5051 Journal Center Blvd., NE, ...