INTERNATIONAL PATENT: XIAMEN UNIVERSITY, 厦门大学 FILES APPLICATION FOR "WAFER ELECTROPLATING DEVICE AND INTEGRATED WAFER ELECTROPLATING METHOD"

GENEVA, May 10 -- XIAMEN UNIVERSITY (No. 422, Siming South RoadXiamen, Fujian 361005), 厦门大学 (中国福建省厦门市思明南路422号) filed a patent application (PCT/CN2023/137820) for "WAFER ELECTROPLATING DEVICE AND INTEGRATED WAFER ELECTROPLATING METHOD" on Dec 11, 2023. With publication no. WO/2025/091632, the details related to the patent application was published on May 08, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SUN, Jianjun (Building 1, Energy, Xiangan Campus, Xiamen UniversityXian...