INTERNATIONAL PATENT: WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD., 武汉新芯集成电路制造有限公司 FILES APPLICATION FOR "BONDING METHOD, WAFER STACK STRUCTURE AND CHIP STRUCTURE"

GENEVA, March 16 -- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. (No. 18 Gaoxin 4TH Road, Donghu Development Zone WuhanWuhan, Hubei 430205), 武汉新芯集成电路制造有限公司 (中国湖北省武汉市东湖开发区高新四路18号) filed a patent application (PCT/CN2023/125732) for "BONDING METHOD, WAFER STACK STRUCTURE, AND CHIP STRUCTURE" on Oct 20, 2023. With publication no. WO/2025/050470, the details related to the patent application was published on Mar 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) ...