INTERNATIONAL PATENT: WOLFSPEED, INC. FILES APPLICATION FOR "LASER EDGE SHAPING FOR SEMICONDUCTOR WAFERS"

GENEVA, Oct. 14 -- WOLFSPEED, INC. (4600 Silicon Dr.Durham, North Carolina 27703) filed a patent application (PCT/US2025/019900) for "LASER EDGE SHAPING FOR SEMICONDUCTOR WAFERS" on Mar 14, 2025. With publication no. WO/2025/212250, the details related to the patent application was published on Oct 09, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BUDD, Joseph Taylor (c/o Wolfspeed, Inc.4600 Silicon DriveDurham, North Carolina 27703), WHITMORE, Tyler Evan Irion (c/o Wolfspeed, Inc.4600 Silicon DriveDurham, North Carolina 27703), MCCLURE, Davis Andrew (c/o Wolfspeed, Inc.4600 Silicon DriveD...