INTERNATIONAL PATENT: WOLFSPEED, INC. FILES APPLICATION FOR "LASER-BASED PROCESSING FOR SEMICONDUCTOR WAFERS"

GENEVA, Nov. 25 -- WOLFSPEED, INC. (4600 Silicon Dr.Durham, North Carolina 27703) filed a patent application (PCT/US2025/028817) for "LASER-BASED PROCESSING FOR SEMICONDUCTOR WAFERS" on May 12, 2025. With publication no. WO/2025/240282, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DIEHL, Devon Michael (c/o Wolfspeed, Inc.4600 Silicon DriveDurham, North Carolina 27703)

Abstract: An example method includes providing a first semiconductor workpiece including a first portion and a second portion. The example method includ...