INTERNATIONAL PATENT: WOLFSPEED, INC. FILES APPLICATION FOR "DISC GRINDING FOR SEMICONDUCTOR WAFERS ON POLISHING SYSTEM"

GENEVA, Sept. 18 -- WOLFSPEED, INC. (4600 Silicon DriveDurham, North Carolina 27703) filed a patent application (PCT/US2025/018720) for "DISC GRINDING FOR SEMICONDUCTOR WAFERS ON POLISHING SYSTEM" on Mar 06, 2025. With publication no. WO/2025/188982, the details related to the patent application was published on Sep 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BUBEL, Simon (c/o WOLFSPEED, INC.4600 Silicon DriveDurham, North Carolina 27703), KARUNARATNE, Dinusha Priyadarshani (c/o WOLFSPEED, INC.4600 Silicon DriveDurham, North Carolina 27703)

Abstract: Grind discs for semiconductor ...