INTERNATIONAL PATENT: WOLFSPEED, INC. FILES APPLICATION FOR "DIRECT BONDED SEMICONDUCTOR DIE PACKAGE"

GENEVA, April 30 -- WOLFSPEED, INC. (4600 Silicon Dr.Durham, North Carolina 27703) filed a patent application (PCT/US2024/050932) for "DIRECT BONDED SEMICONDUCTOR DIE PACKAGE" on Oct 11, 2024. With publication no. WO/2025/085331, the details related to the patent application was published on Apr 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BALARAMAN, Devarajan (c/o Wolfspeed, Inc.4600 Silicon DriveDurham, North Carolina 27703), DADVAND, Afshin (c/o Wolfspeed, Inc.4600 Silicon DriveDurham, North Carolina 27703), RICHTER, Daniel Ginn (c/o Wolfspeed, Inc.4600 Silicon DriveDurham, North C...