INTERNATIONAL PATENT: WATLOW ELECTRIC MANUFACTURING COMPANY FILES APPLICATION FOR "ELASTOMER BOND METHOD FOR ELECTROSTATIC CHUCK ASSEMBLIES WITH THERMALLY ACTIVATED FILLERS FOR ADJUSTABLE LOW TEMPERATURE DEBONDING PROCESS"

GENEVA, Dec. 10 -- WATLOW ELECTRIC MANUFACTURING COMPANY (12001 Lackland RoadSt. Louis, MO 63146) filed a patent application (PCT/US2025/031685) for "ELASTOMER BOND METHOD FOR ELECTROSTATIC CHUCK ASSEMBLIES WITH THERMALLY ACTIVATED FILLERS FOR ADJUSTABLE LOW TEMPERATURE DEBONDING PROCESS" on May 30, 2025. With publication no. WO/2025/250959, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BAUTISTA, Christopher (39078 Guardino Drive, Unit 303Fremont, CA 94538), PHALER, Richard (730 Celestial LaneFoster City, CA 94404), MAD...