GENEVA, Dec. 28 -- WANG, Chungpao (No.296-18, Beitun Road, Beitun District, Taichung CityTaiwan 40645), 王忠宝 (中国台湾省台中市北屯区北屯路296之18号) filed a patent application (PCT/CN2024/099557) for "SEMICONDUCTOR PACKAGING APPARATUS" on Jun 17, 2024. With publication no. WO/2025/260208, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WANG, Chungpao (No.296-18, Beitun Road, Beitun District, Taichung CityTai...