GENEVA, Oct. 18 -- WACKER CHEMIE AG (Gisela-Stein-Str. 181671 Munchen) filed a patent application (PCT/EP2024/059634) for "METHOD FOR IMPROVING ADHESION TO COPPER SURFACES" on Apr 09, 2024. With publication no. WO/2025/214588, the details related to the patent application was published on Oct 16, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SANDMEYER, Frank (c/o Wacker Chemie AGHanns-Seidel-Platz 481737 Munchen), KNOR, Sebastian (c/o Wacker Chemie AGHanns-Seidel-Platz 4Munchen 81737)
Abstract: The present invention relates to a method for producing a copper-clad laminate for use in high-...