INTERNATIONAL PATENT: VISHAY SEMICONDUCTOR GMBH, VISHAY INTERTECHNOLOGY, INC. FILES APPLICATION FOR "PRESSURE SENSOR WITH MOLDED SUBSTRATE"

GENEVA, Sept. 10 -- VISHAY SEMICONDUCTOR GMBH (Theresienstr. 274072 Heilbronn D), VISHAY INTERTECHNOLOGY, INC. (63 Lancaster AvenueMalvern, Pennsylvania 19355) filed a patent application (PCT/US2025/017576) for "PRESSURE SENSOR WITH MOLDED SUBSTRATE" on Feb 27, 2025. With publication no. WO/2025/184337, the details related to the patent application was published on Sep 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CROMWELL, Kevin (Schmollerstr. 7174074 Heilbronn), GOLDAU, Jan Willem (Bachstr. 774388 Talheim)

Abstract: A pressure sensor and method of making the same including a body ...