INTERNATIONAL PATENT: VIAPHOTON, INC. FILES APPLICATION FOR "HIGH DENSITY MODULE WITH MULTICORE FIBER DISTRIBUTION"

GENEVA, Oct. 6 -- VIAPHOTON, INC. (3557 Butterfield Road, Suite 105Aurora, Illinois 60502) filed a patent application (PCT/US2025/021375) for "HIGH DENSITY MODULE WITH MULTICORE FIBER DISTRIBUTION" on Mar 25, 2025. With publication no. WO/2025/207658, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HENDRIX, Walter Mark (3557 Butterfield Road, Suite 105Aurora, Illinois 60502)

Abstract: An apparatus comprises a module (212). The module comprising a module housing (310) and an array of Very Small Form Factor (VSFF) connecto...