INTERNATIONAL PATENT: VIAPHOTON, INC. FILES APPLICATION FOR "HIGH DENSITY MODULE WITH INTEGRATED EXPANDED BEAM OPTICAL CONNECTOR"

GENEVA, Aug. 26 -- VIAPHOTON, INC. (3557 Butterfield Road, Suite 105Aurora, IL 60502) filed a patent application (PCT/US2025/016123) for "HIGH DENSITY MODULE WITH INTEGRATED EXPANDED BEAM OPTICAL CONNECTOR" on Feb 14, 2025. With publication no. WO/2025/175232, the details related to the patent application was published on Aug 21, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HENDRIX, Walter, Mark (3557 Butterfield Road, Suite 105Aurora, IL 60502), MARANTO, Keith, Samuel (3557 Butterfield Road, Suite 105Aurora, IL 60502), SMRHA, Mark, James (3557 Butterfield Road, Suite 105Aurora, IL 60502)...