INTERNATIONAL PATENT: VERTIV CORPORATION FILES APPLICATION FOR "SYSTEMS AND METHODS FOR COOLING HIGH POWER DENSITY DATA CENTERS"

GENEVA, Nov. 19 -- VERTIV CORPORATION (505 North Cleveland AvenueWesterville, Ohio 43082) filed a patent application (PCT/US2025/028180) for "SYSTEMS AND METHODS FOR COOLING HIGH POWER DENSITY DATA CENTERS" on May 07, 2025. With publication no. WO/2025/235636, the details related to the patent application was published on Nov 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): RANČIĆ, Denis (Pusina 6A10430 Samobor), STIBI, Krunoslav (Horvaćanska cesta 16810119 Zagreb)

Abstract: A cooling system can include a first wall configured to be disposed in fluid communication with a f...