INTERNATIONAL PATENT: V & G INFORMATION SYSTEM CO., LTD., 上海威固信息技术股份有限公司 FILES APPLICATION FOR "MODULAR DESIGN-BASED CHIP PACKAGING METHOD AND SYSTEM"

GENEVA, June 9 -- V & G INFORMATION SYSTEM CO., LTD. (2nd Floor, Building 2, No. 1508 Kunyang RoadMinhang District, Shanghai 201111), 上海威固信息技术股份有限公司 (中国上海市闵行区昆阳路1508号2幢2层) filed a patent application (PCT/CN2024/115142) for "MODULAR DESIGN-BASED CHIP PACKAGING METHOD AND SYSTEM" on Aug 28, 2024. With publication no. WO/2025/112722, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intelle...