GENEVA, April 28 -- USHIO DENKI KABUSHIKI KAISHA (1-6-5, Marunouchi, Chiyoda-ku, Tokyo1008150), ウシオ電機株式会社 (東京都千代田区丸の内一丁目6番5号) filed a patent application (PCT/JP2024/029376) for "BUILD-UP SUBSTRATE PROCESSING METHOD, AND BUILD-UP SUBSTRATE PROCESSING DEVICE" on Aug 20, 2024. With publication no. WO/2025/083991, the details related to the patent application was published on Apr 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO)....