GENEVA, July 8 -- UPM-KYMMENE CORPORATION (Alvar Aallon katu 100100 Helsinki) filed a patent application (PCT/FI2024/050701) for "HEAT SEALABLE PACKAGING MATERIAL" on Dec 17, 2024. With publication no. WO/2025/141241, the details related to the patent application was published on Jul 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): LITTUNEN, Kuisma (c/o UPM-Kymmene Corporation / IPRAlvar Aallon katu 100100 Helsinki), KUNNAS, Leena (c/o UPM-Kymmene Corporation / IPRAlvar Aallon katu 100100 Helsinki), TOIVANEN, Timo P (c/o UPM-Kymmene Corporation / IPRAlvar Aallon katu 100100 Helsinki)
Abs...