GENEVA, April 14 -- UNIVERSITEIT LEIDEN (Rapenburg 702311 EZ Leiden) filed a patent application (PCT/EP2024/077623) for "LAYERED STRUCTURE" on Oct 01, 2024. With publication no. WO/2025/073704, the details related to the patent application was published on Apr 10, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): VAN GEEST, Erik Pieter (Rapenburg 702311 EZ Leiden), CAN, Batuhan (Rapenburg 702311 EZ Leiden), VAN RUITENBEEK, Jan (Rapenburg 702311 EZ Leiden), SCHNEIDER, Gregory F. (Rapenburg 702311 EZ Leiden)
Abstract:
A layered structure comprises: a silicon dioxide substrate; a polycyclic ar...