INTERNATIONAL PATENT: UNILUMIN GROUP CO., LTD., 深圳市洲明科技股份有限公司 FILES APPLICATION FOR "CHIP PACKAGING STRUCTURE, CHIP PACKAGING METHOD, CHIP SORTING METHOD, CHIP TRANSFERRING METHOD AND DISPLAY DEVICE"

GENEVA, Feb. 2 -- UNILUMIN GROUP CO., LTD. (Building A #112, Yongfu Rd, Qiaotou Village, Fuyong Town, Baoan DistrictShenzhen, Guangdong 518103), 深圳市洲明科技股份有限公司 (中国广东省深圳市宝安区福永街道桥头社区永福路112号A栋) filed a patent application (PCT/CN2024/086870) for "CHIP PACKAGING STRUCTURE, CHIP PACKAGING METHOD, CHIP SORTING METHOD, CHIP TRANSFERRING METHOD AND DISPLAY DEVICE" on Apr 09, 2024. With publication no. WO/2025/020578, the details related to the patent application was published on Jan 30, 2025.

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