GENEVA, Feb. 16 -- TUPAI, SA (RASO DE PAREDES AP.30993754-901 AGUEDA) filed a patent application (PCT/IB2024/055395) for "A SCREWLESS COVER PLATE ASSEMBLY" on Jun 03, 2024. With publication no. WO/2025/032387, the details related to the patent application was published on Feb 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): GOMES PEREIRA, Francisco Jose (RUA PROF. DR. DUARTE PEREIRA Ndegree 264 R/CHAO DIREITO3880-293 OVAR)
Abstract:
It is described a screwless cover plate assembly that represents an improved cover plate assembly, such that the assembly work is reduced and simplified ov...