INTERNATIONAL PATENT: TTM TECHONOLOGIES INC. FILES APPLICATION FOR "SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH-HOLES HAVING WRAPPING STRUCTURES IN PRINTED CIRCUIT BOARDS"

GENEVA, Aug. 26 -- TTM TECHONOLOGIES INC. (200 East SandpointSuite 400Santa Ana, California 92707) filed a patent application (PCT/US2025/015643) for "SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH-HOLES HAVING WRAPPING STRUCTURES IN PRINTED CIRCUIT BOARDS" on Feb 12, 2025. With publication no. WO/2025/174916, the details related to the patent application was published on Aug 21, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NEELY, Matthew Douglas (200 East SandpointSuite 400Santa Ana, California 92707), KONRAD, John Joseph (200 East SandpointSuite 400Santa Ana, California 92707),...