INTERNATIONAL PATENT: TRUMPF LASER SE FILES APPLICATION FOR "MACHINING HEAD, LASER SYSTEM AND METHOD FOR MULTISPOT MATERIAL MACHINING"

GENEVA, July 19 -- TRUMPF LASER SE (Aichhalder Strasse 3978713 Schramberg) filed a patent application (PCT/EP2024/086124) for "MACHINING HEAD, LASER SYSTEM AND METHOD FOR MULTISPOT MATERIAL MACHINING" on Dec 13, 2024. With publication no. WO/2025/149286, the details related to the patent application was published on Jul 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SPEKER, Nicolai (Buchenweg 1174385 Pleidelsheim), HESSE, Tim (Haldenstrasse 5471254 Ditzingen), BOCKSROCKER, Oliver (Schillerstr. 774343 Sachsenheim)

Abstract: The invention relates to a machining head (3), to a laser mac...