INTERNATIONAL PATENT: TRUMPF LASER- UND SYSTEMTECHNIK SE FILES APPLICATION FOR "DEVICE AND METHOD FOR CUTTING THROUGH A WORKPIECE BY MEANS OF A LASER BEAM"

GENEVA, Feb. 24 -- TRUMPF LASER- UND SYSTEMTECHNIK SE (Johann-Maus-Strasse 271254 Ditzingen) filed a patent application (PCT/EP2024/070661) for "DEVICE AND METHOD FOR CUTTING THROUGH A WORKPIECE BY MEANS OF A LASER BEAM" on Jul 22, 2024. With publication no. WO/2025/036655, the details related to the patent application was published on Feb 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BOCKSROCKER, Oliver (Schillerstr. 774343 Sachsenheim), SPEKER, Nicolai (Buchenweg 1174385 Pleidelsheim), MOLLER, Mauritz (Pestalozziweg 4/270825 Korntal)

Abstract: The invention relates to a device (10...