GENEVA, Feb. 18 -- TRIO PACKAGING INDUSTRIAL PTE LTD (52 Woodlands Industrial Park E7Singapore 757825) filed a patent application (PCT/SG2024/050507) for "CORRUGATED BOARD COFFIN" on Aug 08, 2024. With publication no. WO/2025/034174, the details related to the patent application was published on Feb 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): CHAN, Jun Wei (52 Woodlands Industrial Park E7Singapore 757825)
Abstract:
The invention is directed to a corrugated board coffin comprising a receptacle for receiving a corpse, a bottom tray wherein the receptacle is inserted into the bottom ...