INTERNATIONAL PATENT: TPI TECHNOLOGY, INC. FILES APPLICATION FOR "DIGITAL THREE DIMENSIONAL (3D) MEASUREMENT OF BONDLINE THICKNESS AND WIDTH DURING BLADE ASSEMBLY"

GENEVA, May 28 -- TPI TECHNOLOGY, INC. (8501 N. Scottsdale Road, Suite 100Scottsdale, AZ 85253) filed a patent application (PCT/US2024/056355) for "DIGITAL THREE DIMENSIONAL (3D) MEASUREMENT OF BONDLINE THICKNESS AND WIDTH DURING BLADE ASSEMBLY" on Nov 18, 2024. With publication no. WO/2025/106957, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PUHURCUOĞLU, Nihal (Esentepe Mah. 88094 Sk. No:6 CigliModern Sitesi A Blok Daire:31 CigliIzmir), PEDRAMASL, Nima (Yali Mah. 6523 Sk. No: 30A Soyak Optimus Mavisehir (A1-268) ...