GENEVA, March 17 -- TOYOBO CO., LTD. (13-1, Umeda 1-chome, Kita-ku, Osaka-shi, Osaka5300001), 東洋紡株式会社 (大阪府大阪市北区梅田一丁目13番1号) filed a patent application (PCT/JP2024/031137) for "LAMINATED FILM, LID MATERIAL, AND PACKAGING CONTAINER" on Aug 30, 2024. With publication no. WO/2025/053063, the details related to the patent application was published on Mar 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MANABE,Nobuyuki (c/o...