GENEVA, April 28 -- TOYO SEIKAN CO.,LTD. (18-1, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo1418640), 東洋製罐株式会社 (東京都品川区東五反田２丁目１８番１号) filed a patent application (PCT/JP2024/028956) for "MARKING READING DEVICE FOR METAL MOLDED ARTICLE, MANAGEMENT SYSTEM FOR METAL MOLDED ARTICLE, AND MARKING READING METHOD FOR METAL MOLDED ARTICLE" on Aug 14, 2024. With publication no. WO/2025/083985, the details related to the patent application was published on Apr 24, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, ...