INTERNATIONAL PATENT: TOWA CORPORATION, ＴＯＷＡ株式会社 FILES APPLICATION FOR "UPPER MOLD, RESIN MOLDING DEVICE AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE"

GENEVA, Dec. 9 -- TOWA CORPORATION (5, Kamitoba Kamichoshi-cho, Minami-ku, Kyoto-shi, Kyoto6018105), ＴＯＷＡ株式会社 (京都府京都市南区上鳥羽上調子町５番地) filed a patent application (PCT/JP2024/043421) for "UPPER MOLD, RESIN MOLDING DEVICE, AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE" on Dec 09, 2024. With publication no. WO/2025/248823, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (...