GENEVA, April 7 -- TOWA CORPORATION (5, Kamitoba Kamichoshi-cho, Minami-ku, Kyoto-shi, Kyoto6018105), TOWA株式会社 (京都府京都市南区上鳥羽上調子町5番地) filed a patent application (PCT/JP2024/016140) for "RESIN MATERIAL SUPPLY DEVICE, RESIN MATERIAL SUPPLY METHOD, RESIN MATERIAL SUPPLY PROGRAM, RESIN MOLDED ARTICLE MANUFACTURING DEVICE, AND RESIN MOLDED ARTICLE MANUFACTURING METHOD" on Apr 24, 2024. With publication no. WO/2025/069532, the details related to the patent application was published on Apr 03, 2025.
Notably, the patent application was submitted under the International P...