INTERNATIONAL PATENT: TOSOH CORPORATION, 東ソー株式会社 FILES APPLICATION FOR "NON-CROSSLINKED FOAMED MOLDED BODY COMPRISING POLYETHYLENE-BASED RESIN"

GENEVA, Dec. 23 -- TOSOH CORPORATION (4560, Kaisei-cho, Shunan-shi, Yamaguchi7468501), 東ソー株式会社 (山口県周南市開成町４５６０番地) filed a patent application (PCT/JP2025/020933) for "NON-CROSSLINKED FOAMED MOLDED BODY COMPRISING POLYETHYLENE-BASED RESIN" on Jun 10, 2025. With publication no. WO/2025/258589, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SUZUKI Kenichi (c/o TOSOH CORPORAT...