GENEVA, May 27 -- TORAY INDUSTRIES, INC. (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038666), 東レ株式会社 (東京都中央区日本橋室町2丁目1番1号) filed a patent application (PCT/JP2024/040098) for "SANDWICH STRUCTURE BODY, AND INTEGRALLY-MOLDED BODY USING SAME" on Nov 12, 2024. With publication no. WO/2025/105360, the details related to the patent application was published on May 22, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): TAKAHASHI Yu...