INTERNATIONAL PATENT: TOPPAN HOLDINGS INC., ＴＯＰＰＡＮホールディングス株式会社 FILES APPLICATION FOR "MULTILAYER FILM, PACKAGING MATERIAL AND PACKAGE"

GENEVA, Dec. 1 -- TOPPAN HOLDINGS INC. (5-1, Taito 1-chome, Taito-ku, Tokyo1100016), ＴＯＰＰＡＮホールディングス株式会社 (東京都台東区台東１丁目５番１号) filed a patent application (PCT/JP2025/017066) for "MULTILAYER FILM, PACKAGING MATERIAL, AND PACKAGE" on May 09, 2025. With publication no. WO/2025/243870, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organ...