GENEVA, Jan. 6 -- TOPPAN HOLDINGS INC. (5-1, Taito 1-chome, Taito-ku, Tokyo1100016), ＴＯＰＰＡＮホールディングス株式会社 (東京都台東区台東１丁目５番１号) filed a patent application (PCT/JP2025/022890) for "METHOD FOR MANUFACTURING PACKAGING BAG, AND PACKAGING BAG" on Jun 25, 2025. With publication no. WO/2026/004923, the details related to the patent application was published on Jan 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Prope...