GENEVA, May 12 -- TOPOLOGIC INC. (7-3-1, Hongo, Bunkyo-ku, Tokyo1138485), ＴｏｐｏＬｏｇｉｃ株式会社 (東京都文京区本郷七丁目３番１号) filed a patent application (PCT/JP2024/035438) for "MEASUREMENT SYSTEM AND METHOD FOR ADJUSTING TEMPERATURE DISTRIBUTION IN WAFER" on Oct 03, 2024. With publication no. WO/2025/094582, the details related to the patent application was published on May 08, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inven...