INTERNATIONAL PATENT: TONGJI UNIVERSITY, 同济大学 FILES APPLICATION FOR "ELECTRORHEOLOGICAL POLISHING APPARATUS AND POLISHING METHOD BASED ON WIRE ELECTRODE OR MULTI-WIRE ELECTRODE"

GENEVA, Dec. 11 -- TONGJI UNIVERSITY (No. 1239, Siping RoadYangpu District, Shanghai 200092), 同济大学 (中国上海市杨浦区四平路1239号) filed a patent application (PCT/CN2025/110478) for "ELECTRORHEOLOGICAL POLISHING APPARATUS AND POLISHING METHOD BASED ON WIRE ELECTRODE OR MULTI-WIRE ELECTRODE" on Jul 25, 2025. With publication no. WO/2025/247427, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WANG, Kun (No. 1239, Siping RoadYa...