GENEVA, Feb. 8 -- TONGFU MICROELECTRONICS CO., LTD. (No. 288, Chongchuan RoadNantong, Jiangsu 226004) filed a patent application (PCT/CN2025/111818) for "CHIP PACKAGING METHOD AND STRUCTURE" on Jul 31, 2025. With publication no. WO/2026/026916, the details related to the patent application was published on Feb 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): TAO, Yujuan (No. 288,Chongchuan RoadNantong, Jiangsu 226004), ZHU, Qiuyun (No. 288,Chongchuan RoadNantong, Jiangsu 226004), YANG, Ling (No. 288,Chongchuan RoadNantong, Jiangsu 226004)
Abstract: A method for chip packaging includes pr...