INTERNATIONAL PATENT: TOKYO SEIMITSU CO., LTD., 株式会社東京精密 FILES APPLICATION FOR "WAFER PROCESSING SYSTEM AND WAFER PROCESSING METHOD"

GENEVA, June 24 -- TOKYO SEIMITSU CO., LTD. (2968-2, Ishikawa-machi, Hachioji-shi, Tokyo1928515), 株式会社東京精密 (東京都八王子市石川町２９６８－２) filed a patent application (PCT/JP2024/043154) for "WAFER PROCESSING SYSTEM AND WAFER PROCESSING METHOD" on Dec 06, 2024. With publication no. WO/2025/126961, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MORIYAMA Katsufumi (c/o To...