INTERNATIONAL PATENT: TOKYO SEIMITSU CO., LTD., 株式会社東京精密 FILES APPLICATION FOR "WAFER DEFECT INSPECTION SYSTEM, WAFER DEFECT INSPECTION DEVICE AND WAFER DEFECT INSPECTION METHOD"

GENEVA, Dec. 9 -- TOKYO SEIMITSU CO., LTD. (2968-2, Ishikawa-machi, Hachioji-shi, Tokyo1928515), 株式会社東京精密 (東京都八王子市石川町２９６８－２) filed a patent application (PCT/JP2025/014418) for "WAFER DEFECT INSPECTION SYSTEM, WAFER DEFECT INSPECTION DEVICE, AND WAFER DEFECT INSPECTION METHOD" on Apr 11, 2025. With publication no. WO/2025/248994, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (W...