INTERNATIONAL PATENT: TOKYO SEIMITSU CO., LTD., 株式会社東京精密 FILES APPLICATION FOR "SHAPE MEASUREMENT DEVICE, SHAPE MEASUREMENT METHOD AND WAFER PROCESSING SYSTEM"

GENEVA, June 24 -- TOKYO SEIMITSU CO., LTD. (2968-2, Ishikawa-machi, Hachioji-shi, Tokyo1928515), 株式会社東京精密 (東京都八王子市石川町２９６８－２) filed a patent application (PCT/JP2024/043153) for "SHAPE MEASUREMENT DEVICE, SHAPE MEASUREMENT METHOD, AND WAFER PROCESSING SYSTEM" on Dec 06, 2024. With publication no. WO/2025/126960, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s)...