GENEVA, Feb. 10 -- TOKYO SEIMITSU CO., LTD. (2968-2, Ishikawa-machi, Hachioji-shi, Tokyo1928515), 株式会社東京精密 (東京都八王子市石川町２９６８－２) filed a patent application (PCT/JP2025/026565) for "PROCESSING METHOD AND PROCESSING DEVICE" on Jul 25, 2025. With publication no. WO/2026/028963, the details related to the patent application was published on Feb 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): AIKAWA, Chikara (c/o TOKYO SEIMITSU CO...