INTERNATIONAL PATENT: TOKYO SEIMITSU CO., LTD., 株式会社東京精密 FILES APPLICATION FOR "GRINDING PERFORMANCE DETERMINATION DEVICE AND GRINDING PERFORMANCE DETERMINATION METHOD"

GENEVA, Oct. 5 -- TOKYO SEIMITSU CO., LTD. (2968-2, Ishikawa-machi, Hachioji-shi, Tokyo1928515), 株式会社東京精密 (東京都八王子市石川町２９６８－２) filed a patent application (PCT/JP2025/011727) for "GRINDING PERFORMANCE DETERMINATION DEVICE AND GRINDING PERFORMANCE DETERMINATION METHOD" on Mar 25, 2025. With publication no. WO/2025/205763, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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