GENEVA, Oct. 5 -- TOKYO SEIMITSU CO., LTD. (2968-2, Ishikawa-machi, Hachioji-shi, Tokyo1928515), 株式会社東京精密 (東京都八王子市石川町２９６８－２) filed a patent application (PCT/JP2025/011780) for "DICING APPARATUS AND TRIMMING METHOD FOR DICING APPARATUS" on Mar 25, 2025. With publication no. WO/2025/205798, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KATO Ayano (c/o TOKYO...