INTERNATIONAL PATENT: TOKYO SEIMITSU CO., LTD., 株式会社東京精密 FILES APPLICATION FOR "CHAMFERING DEVICE FOR WAFER AND CHAMFERING METHOD"

GENEVA, Oct. 5 -- TOKYO SEIMITSU CO., LTD. (2968-2, Ishikawa-machi, Hachioji-shi, Tokyo1928515), 株式会社東京精密 (東京都八王子市石川町２９６８－２) filed a patent application (PCT/JP2025/007050) for "CHAMFERING DEVICE FOR WAFER, AND CHAMFERING METHOD" on Feb 28, 2025. With publication no. WO/2025/204479, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KISHISHITA Shinichi (c/o TOS...