GENEVA, Oct. 5 -- TOKYO OHKA KOGYO CO., LTD. (150, Nakamaruko, Nakahara-ku, Kawasaki-shi, Kanagawa2110012), 東京応化工業株式会社 (神奈川県川崎市中原区中丸子１５０番地) filed a patent application (PCT/JP2025/010076) for "TREATMENT LIQUID, METHOD FOR TREATING SUBSTRATE USING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE" on Mar 17, 2025. With publication no. WO/2025/205126, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is m...