INTERNATIONAL PATENT: TOKYO OHKA KOGYO CO., LTD., 東京応化工業株式会社 FILES APPLICATION FOR "RESIST MATERIAL, RESIST MATERIAL FOR DRY ETCHING, PATTERN FORMING METHOD AND STRUCTURE"

GENEVA, Nov. 25 -- TOKYO OHKA KOGYO CO., LTD. (150, Nakamaruko, Nakahara-ku, Kawasaki-shi, Kanagawa2110012), 東京応化工業株式会社 (神奈川県川崎市中原区中丸子１５０番地) filed a patent application (PCT/JP2025/017276) for "RESIST MATERIAL, RESIST MATERIAL FOR DRY ETCHING, PATTERN FORMING METHOD, AND STRUCTURE" on May 12, 2025. With publication no. WO/2025/239333, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Inte...