GENEVA, July 8 -- TOKYO OHKA KOGYO CO., LTD. (150, Nakamaruko, Nakahara-ku, Kawasaki-shi, Kanagawa2110012), 東京応化工業株式会社 (神奈川県川崎市中原区中丸子１５０番地) filed a patent application (PCT/JP2024/045138) for "PROTECTIVE FILM COMPOSITION FOR DICING, WAFER MANUFACTURING METHOD, AND WAFER PROCESSING METHOD" on Dec 20, 2024. With publication no. WO/2025/142768, the details related to the patent application was published on Jul 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the Wor...