INTERNATIONAL PATENT: TOKYO ELECTRON LIMITED, TOKYO ELECTRON U.S. HOLDINGS, INC. FILES APPLICATION FOR "MIXED-SPECIES BUFFER FILM FOR STRUCTURAL INTEGRITY OF METALLIZATION"

GENEVA, Nov. 18 -- TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-kuTokyo, 107-6325), TOKYO ELECTRON U.S. HOLDINGS, INC. (401 S 1st St, Suite 900Austin, Texas 78704) filed a patent application (PCT/US2025/017315) for "MIXED-SPECIES BUFFER FILM FOR STRUCTURAL INTEGRITY OF METALLIZATION" on Feb 26, 2025. With publication no. WO/2025/235059, the details related to the patent application was published on Nov 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ROGERS, Jack (650 MitsuzawaHosaka-cho, Nirasaki City, Yamanashi 407-0192), LEE, Tek Po Rinus (NanoFab 300 South 255 Fuller Rd., Suite...