INTERNATIONAL PATENT: TOKYO ELECTRON LIMITED, TOKYO ELECTRON U.S. HOLDINGS, INC. FILES APPLICATION FOR "METHOD OF HYBRID BONDING USING DIE DISTRIBUTION MODEL"

GENEVA, Sept. 2 -- TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-kuTokyo, 107-6325), TOKYO ELECTRON U.S. HOLDINGS, INC. (401 S 1st StSuite 900Austin, Texas 78704) filed a patent application (PCT/US2025/013265) for "METHOD OF HYBRID BONDING USING DIE DISTRIBUTION MODEL" on Jan 27, 2025. With publication no. WO/2025/178721, the details related to the patent application was published on Aug 28, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MUKHOPADHYAY, Partha (NanoFab 300 South, 255 Fuller Rd.Suite 214Albany, New York 12203), FULFORD, H. Jim (NanoFab 300 South, 255 Fuller Rd.Suite 214A...